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Glossary

3,801 technical terms and definitions

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megasonic cleaning equipment

megasonic transducer, megasonic bath, single-wafer megasonic system, megasonic nozzle, acoustic cleaning equipment

Megasonic cleaning couples high-frequency acoustic energy, commonly in the high-kilohertz to low-megahertz regime, into a liquid to remove particulate contamination from wafer…

memory architecture design

sram cache design, memory hierarchy chip, embedded memory compiler, register file design

On-Chip Memory Architecture is the design discipline that organizes the hierarchy of registers, SRAM caches, and embedded memories within a processor or SoC — where memory access…

hbm packaging

HBM stack, high bandwidth memory packaging, HBM3E packaging, HBM4 packaging, TSV DRAM stack, hbm

High-bandwidth memory (HBM) is DRAM stacked vertically and connected to its host through an interface thousands of bits wide, running beside the processor on an interposer rather…

memory bandwidth hbm2

hbm2 memory, advanced packaging, memory stacking

High-bandwidth memory (HBM) is DRAM stacked vertically and connected to its host through an interface thousands of bits wide, running beside the processor on an interposer rather…

memory bandwidth hbm3

hbm3 memory, advanced packaging, memory stacking

High-bandwidth memory (HBM) is DRAM stacked vertically and connected to its host through an interface thousands of bits wide, running beside the processor on an interposer rather…

memory stacking

advanced packaging

High-bandwidth memory (HBM) is DRAM stacked vertically and connected to its host through an interface thousands of bits wide, running beside the processor on an interposer rather…

memory testing repair semiconductor

memory bist redundancy, memory fault model march test, memory repair fuse laser, memory yield redundancy analysis

Design-for-test architectures, automatic test pattern generation, and structural fault modeling constitute the digital verification and manufacturing test disciplines engineered…

mems cmos integration

sacrificial release etch, eutectic bonding, cap wafer sealing, monolithic mems cmos, mems on cmos, process compatibility, thermal budget conflict, wafer level cap, packaging sensitive sensor

MEMS-CMOS integration combines microelectromechanical structures — moving parts, cavities, flexible membranes — with CMOS electronics so sensing, actuation, and signal processing…

mems fabrication

mems, process

MEMS fabrication is the manufacturing of micro-electro-mechanical systems that integrate mechanical structures, sensors, and electronics on semiconductor substrates - it combines…

mems fabrication

micro electro mechanical system, mems process, surface micromachining, bulk micromachining

MEMS Fabrication is the specialized semiconductor manufacturing discipline that combines standard IC processing techniques (lithography, deposition, etching) with mechanical…

mems fabrication process

surface micromachining bulk, mems release etch, mems packaging hermetic, mems sensor accelerometer gyro

MEMS Semiconductor Fabrication is a specialized processing framework combining standard CMOS techniques with advanced sacrificial layer chemistry and precision mechanical etching…

mems packaging

mems, packaging

MEMS packaging is the specialized packaging of MEMS devices that protects mechanical structures while preserving required environmental and electrical interfaces - package design…

mems sensor fabrication

microelectromechanical systems manufacturing, mems process integration, mems device packaging, mems wafer processing

MEMS Sensor Fabrication Technology — Microelectromechanical Systems Manufacturing and Process Integration MEMS (Microelectromechanical Systems) sensor fabrication combines…