AlSiCu

# AlSiCu

AlSiCu is an aluminum alloy containing silicon and copper.

## Connect the name to its role

Document whether this film is a target, mask, liner, electrode or temporary layer at the step being discussed. The same material can have different roles in different modules.

## Integration context

In appropriate older contact schemes, silicon additions help limit aluminum interaction with silicon, while copper additions address reliability concerns such as electromigration. Their effects depend on concentration and integration. This material name does not specify a universal alloy percentage or etch recipe.

## What to verify

Confirm composition and underlying contact/barrier design; check contact resistance, residues and corrosion.

Before selecting removal conditions, identify all exposed neighboring materials and the amount of loss each can tolerate. Verify the result using the measurements appropriate to the structure, then check that the surface is suitable for the next deposition, contact or clean step.

## Related terminology

AlSiCu, aluminum silicon copper alloy. Short abbreviations are local process vocabulary and can have other meanings; use the full module name when searching.

## Source and scope

[Aluminum etch and corrosion control](https://www.nanofab.ualberta.ca/avoiding-corrosion-when-dry-etching-aluminum/). The diagram is an original teaching schematic. Layer choices and process families describe an example rather than a universal manufacturing recipe.

[Example Al/Si/Cu sputtering target specification](https://www.lesker.com/newweb/deposition_materials/depositionmaterials_sputtertargets_1.cfm?pgid=al4): the composition of one supplier product does not define all AlSiCu films.